The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Jun. 17, 2010
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidetoshi Kitaura, Osaka, JP;
Taichi Nakamura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidetoshi Kitaura, Osaka, JP;
Taichi Nakamura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The present invention provides a semiconductor component having a joint structure including a semiconductor device, an electrode disposed opposite the semiconductor device, and a joining material which contains Bi as main component and connects the semiconductor device to the electrode. Since the joining material contains a carbon compound, joint failure due to the difference in linear expansion coefficient between the semiconductor device and the electrode can be reduced compared with conventional materials. The joining material which contains Bi as main component enables provision of a joint structure in which a semiconductor device and an electrode are joined by a joint more reliable than a conventional joint.