The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8338245 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 25, 2012

Filed:

Mar. 14, 2008
Applicants:

Jae Gon Lee, Singapore, SG;

Jong Ho Yang, New York, NY (US);

Victor Chan, Newburgh, NY (US);

Jun Jung Kim, Gyeonggi-do, KR;

Inventors:

Jae Gon Lee, Singapore, SG;

Jong Ho Yang, New York, NY (US);

Victor Chan, Newburgh, NY (US);

Jun Jung Kim, Gyeonggi-do, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit system that includes: providing a substrate including a first region with a first device and a second device and a second region with a resistance device; configuring the first device, the second device, and the resistance device to include a first spacer and a second spacer; forming a stress inducing layer over the first region and the second region; processing at least a portion of the stress inducing layer formed over the first region to alter the stress within the stress inducing layer; and forming a third spacer adjacent the second spacer of the first device and the second device from the stress inducing layer.


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