The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2012

Filed:

Aug. 31, 2007
Applicants:

Jaehong Park, Kyoto, JP;

Shinichi Matsumura, Kyoto, JP;

Kouichi Yoshida, Kyoto, JP;

Yoshitane Shigeta, Kyoto, JP;

Masaharu Kinoshita, Kyoto, JP;

Inventors:

Jaehong Park, Kyoto, JP;

Shinichi Matsumura, Kyoto, JP;

Kouichi Yoshida, Kyoto, JP;

Yoshitane Shigeta, Kyoto, JP;

Masaharu Kinoshita, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surfaceof a polishing padis subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 μm or less. As a result, the flatness of the object polished by the polishing pad, such as a silicon wafer, is improved.


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