The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Jun. 09, 2010
Mark F. Turner, Longmont, CO (US);
Jonathan W. Byrn, Fort Collins, CO (US);
Jeffrey S. Brown, Fort Collins, CO (US);
Mark F. Turner, Longmont, CO (US);
Jonathan W. Byrn, Fort Collins, CO (US);
Jeffrey S. Brown, Fort Collins, CO (US);
LSI Corporation, Milpitas, CA (US);
Abstract
A global power distribution network in an integrated circuit comprising a first layer of conductive material and a second layer of conductive material. The first layer of conductive material may be (i) coupled to one or more power supplies and (ii) configured to form a plurality of first rails of a mesh. The first rails may (a) supply power to one or more components of a core logic of the integrated circuit, (b) be aligned with a first axis of the integrated circuit, and (c) have one or more parameters configured such that the mesh has a uniform voltage gradient from a perimeter of the integrated circuit to a center of the integrated circuit along the first axis. The second layer of conductive material may be (i) coupled to the one or more power supplies and (ii) configured to form a plurality of second rails of the mesh. The second rails may (a) supply power to one or more components of the core logic, (b) be aligned with a second axis of the integrated circuit, and (c) have one or more parameters configured such that the mesh comprises a uniform voltage gradient from the perimeter of the integrated circuit to the center of the integrated circuit along the second axis.