The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Sep. 23, 2009
Gloria Lin, San Ramon, CA (US);
Bryson Gardner, Jr., San Francisco, CA (US);
Joseph Fisher, Jr., San Jose, CA (US);
Dave Goh, Los Altos, CA (US);
Barry Corlett, Brisbane, CA (US);
Dennis Pyper, San Jose, CA (US);
Amir Salehi, San Jose, CA (US);
Gloria Lin, San Ramon, CA (US);
Bryson Gardner, Jr., San Francisco, CA (US);
Joseph Fisher, Jr., San Jose, CA (US);
Dave Goh, Los Altos, CA (US);
Barry Corlett, Brisbane, CA (US);
Dennis Pyper, San Jose, CA (US);
Amir Salehi, San Jose, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in 'bare die' form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board ('flex'). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.