The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Jul. 24, 2008
Takaaki Matsuoka, Minato-ku, JP;
Shinji Ide, Hillsboro, OR (US);
Yoshiyuki Kikuchi, Hillsboro, OR (US);
Takaaki Matsuoka, Minato-ku, JP;
Shinji Ide, Hillsboro, OR (US);
Yoshiyuki Kikuchi, Hillsboro, OR (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
The present invention relates to a manufacturing method for a semiconductor device, the method includes a process for forming an interlayer film on a substrate, a process for forming an opening in the interlayer, a process for forming a conductive layer which fills the opening, and a process for forming a cap film on the surface of the conductive layer. In the process for forming the cap film, a reduction process for the surface of the conductive layer and the forming of the film are performed simultaneously.