The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Mar. 31, 2011
Koki Tamura, Kawasaki, JP;
Takahiro Asai, Kawasaki, JP;
Atsushi Kubo, Kawasaki, JP;
Hirofumi Imai, Kawasaki, JP;
Takahiro Yoshioka, Kawasaki, JP;
Koki Tamura, Kawasaki, JP;
Takahiro Asai, Kawasaki, JP;
Atsushi Kubo, Kawasaki, JP;
Hirofumi Imai, Kawasaki, JP;
Takahiro Yoshioka, Kawasaki, JP;
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Abstract
A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile