The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Dec. 28, 2009
Masayuki Furumiya, Kanagawa, JP;
Hiroaki Ohkubo, Kanagawa, JP;
Fuyuki Okamoto, Kanagawa, JP;
Masayuki Mizuno, Tokyo, JP;
Koichi Nose, Tokyo, JP;
Yoshihiro Nakagawa, Tokyo, JP;
Yoshio Kameda, Tokyo, JP;
Masayuki Furumiya, Kanagawa, JP;
Hiroaki Ohkubo, Kanagawa, JP;
Fuyuki Okamoto, Kanagawa, JP;
Masayuki Mizuno, Tokyo, JP;
Koichi Nose, Tokyo, JP;
Yoshihiro Nakagawa, Tokyo, JP;
Yoshio Kameda, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality of semiconductor chip circuit portions provided over the semiconductor wafer, a plurality of first conductive layers, provided in each of the semiconductor chip forming regions, which is electrically connected to each of the circuit portions, and a first connecting portion that electrically connects the first conductive layers to each other across a portion of the scribe region. An external power supply or grounding pad is connected to any one of the first conductive layer and the first connecting portion. The semiconductor device includes a communication portion, connected to the circuit portion, which performs communication with the outside by capacitive coupling or inductive coupling.