The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2012

Filed:

Nov. 30, 2010
Applicants:

Myoung-hwan OH, Daejeon, KR;

Jun-seok Nho, Daejeon, KR;

Jang-yul Kim, Daejeon, KR;

Jong-pil Kim, Daejeon, KR;

Seung-beom Cho, Daejeon, KR;

Min-jin Ko, Daejeon, KR;

Inventors:

Myoung-hwan Oh, Daejeon, KR;

Jun-seok Nho, Daejeon, KR;

Jang-yul Kim, Daejeon, KR;

Jong-pil Kim, Daejeon, KR;

Seung-beom Cho, Daejeon, KR;

Min-Jin Ko, Daejeon, KR;

Assignee:

LG Chem. Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01F 17/00 (2006.01); B24B 1/00 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); C09G 1/02 (2006.01); C09G 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same, and more particularly, to a method of preparing a cerium oxide powder for a CMP slurry and a method of preparing a CMP slurry using the same in which the specific surface area of the powder is increased by preparing a cerium precursor, and then decomposing and calcinating the prepared cerium precursor. The pore distribution is controlled to increase the chemical contact area between a polished film and a polishing material, thereby reducing polishing time while the physical strength of powder is decreased, which remarkably reduces scratches on a polished film.


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