The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Mar. 19, 2009
Applicants:
Kiyotaka Tsukada, Ogaki, JP;
Takamichi Sugiura, Ogaki, JP;
Inventors:
Kiyotaka Tsukada, Ogaki, JP;
Takamichi Sugiura, Ogaki, JP;
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer is cured to form a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material, and a conductive circuit is formed over the resin complex layer.