The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2012
Filed:
Jan. 31, 2007
Applicant:
Tomas Bauer, Bro, SE;
Inventor:
Tomas Bauer, Bro, SE;
Assignee:
Silex Microsystems AB, Jarfalla, SE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a method of providing a planar substrate with electrical through connections (vias). The method comprises providing a hole in said substrate and a treatment to render the substrate surface exhibiting a lower wettability than the walls inside the hole. The planar substrate is exposed to a molten material with low resistivity, whereby the molten material is drawn into the hole(s). It also relates to a semiconductor wafer as a starting substrate for electronic packaging applications, comprising low resistivity wafer through connections having closely spaced vias.