The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2012

Filed:

Feb. 23, 2009
Applicants:

Zhi-sheng Lian, Shenzhen, CN;

Gen-ping Deng, Shenzhen, CN;

Chun-chi Chen, Taipei Hsien, TW;

Inventors:

Zhi-Sheng Lian, Shenzhen, CN;

Gen-Ping Deng, Shenzhen, CN;

Chun-Chi Chen, Taipei Hsien, TW;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28D 15/00 (2006.01); H05K 7/20 (2006.01); H05K 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.


Find Patent Forward Citations

Loading…