The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Dec. 08, 2009
Chang-hyun Ryu, Cheonan-si, KR;
Ssang-gun Lim, Daejeon, KR;
Dong-hae Son, Asan-si, KR;
Poom-seong Park, Asan-si, KR;
Chang-Hyun Ryu, Cheonan-si, KR;
Ssang-Gun Lim, Daejeon, KR;
Dong-Hae Son, Asan-si, KR;
Poom-Seong Park, Asan-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
INTEKPLUS Co., Ltd., Daejeon, KR;
Abstract
An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.