The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

Jul. 12, 2007
Applicants:

Naoki Ishikawa, Annaka, JP;

Hiroyuki Ohtsuka, Annaka, JP;

Takenori Watabe, Annaka, JP;

Satoyuki Ojima, Annaka, JP;

Toyohiro Ueguri, Annaka, JP;

Inventors:

Naoki Ishikawa, Annaka, JP;

Hiroyuki Ohtsuka, Annaka, JP;

Takenori Watabe, Annaka, JP;

Satoyuki Ojima, Annaka, JP;

Toyohiro Ueguri, Annaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01B 1/22 (2006.01); C04B 41/51 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is directed to a semiconductor substrate having at least an electrode formed thereon, in which the electrode has a multilayer structure including two or more layers, of the multilayer structure, at least a first electrode layer directly bonded to the semiconductor substrate contains at least silver and a glass frit, and contains, as an additive, at least one of oxides of Ti, Bi, Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Si, Al, Ge, Sn, Pb, and Zn, and, of an electrode layer formed on the first electrode layer, at least an uppermost electrode layer to be bonded to a wire contains at least silver and a glass frit and does not contain the additive. This makes it possible to form, on a semiconductor substrate, an electrode adhered to the semiconductor substrate with sufficient adhesive strength and adhered to a wire via solder with sufficient adhesive strength by lowering both contact resistance and interconnect resistance.


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