The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

Jan. 04, 2012
Applicants:

Mingching Wu, Taipei County, TW;

Hsueh-an Yang, Taipei, TW;

Hung-yi Lin, Taoyuan County, TW;

Weileun Fang, Hsinchu, TW;

Inventors:

Mingching Wu, Taipei County, TW;

Hsueh-An Yang, Taipei, TW;

Hung-Yi Lin, Taoyuan County, TW;

Weileun Fang, Hsinchu, TW;

Assignee:

Walsin Lihwa Corp., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.


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