The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Jul. 15, 2010
Chang-ming Lee, Taoyuan County, TW;
Wen-fang Liu, Taoyuan County, TW;
Shih-jung Huang, Taoyuan County, TW;
Ling-kai Su, Taipei, TW;
Chang-Ming Lee, Taoyuan County, TW;
Wen-Fang Liu, Taoyuan County, TW;
Shih-Jung Huang, Taoyuan County, TW;
Ling-Kai Su, Taipei, TW;
Unimicron Technology Corp., Kwei-San Industrial Zone, Taoyuan, TW;
Abstract
Method for fabricating an interposer is provided. A substrate is provided having thereon at least a conductive via and at least a flange. The flange is bonded on the substrate and shades a portion of the via. A photoresist layer is formed on the interior surface of the via, on a contact surface of the flange and on an inner surface of the flange opposite to the contact surface. An opening is formed in the photoresist layer to expose a portion of the contact surface of the flange, while the photoresist layer still covers the interior surface of the via and the inner surface of the flange. A plating layer is formed on the exposed contact surface of the flange. The photoresist layer is then removed.