The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2012

Filed:

Jan. 07, 2009
Applicant:

Robert J. O'donnell, Alameda, CA (US);

Inventor:

Robert J. O'Donnell, Alameda, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 19/00 (2006.01); G11B 11/105 (2006.01); C04B 35/00 (2006.01); C04B 35/03 (2006.01); C04B 35/16 (2006.01); C04B 35/50 (2006.01); C04B 35/51 (2006.01); C04B 35/52 (2006.01); C04B 35/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

Components of semiconductor processing apparatus are formed at least partially of erosion, corrosion and/or corrosion-erosion resistant ceramic materials. Exemplary ceramic materials can include at least one oxide, nitride, boride, carbide and/or fluoride of hafnium, strontium, lanthanum oxide and/or dysprosium. The ceramic materials can be applied as coatings over substrates to form composite components, or formed into monolithic bodies. The coatings ca protect substrates from physical and/or chemical attack. The ceramic materials can be used to form plasma exposed components of semiconductor processing apparatus to provide extended service lives.

Published as:
US2003181065A1; WO03080892A1; AU2003210966A1; TW200305198A; US6780787B2; KR20040101330A; US2005003240A1; EP1495155A1; JP2005521250A; CN1643178A; CN100357489C; TW200802545A; TWI299182B; TWI300587B; US2009068845A1; US2009123735A1; US2009120790A1; IL163917A; JP2010153881A; KR101024514B1; US8318327B2; US2013059071A1; US8935990B2;

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