The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2012

Filed:

Sep. 11, 2007
Applicants:

Gi-sik Hong, Gyeonggi-do, KR;

Dong-jun Lee, Seoul, KR;

Nam-soo Kim, Gyeonggi-do, KR;

Kyoung-moon Kang, Gyeonggi-do, KR;

Inventors:

Gi-Sik Hong, Gyeonggi-do, KR;

Dong-Jun Lee, Seoul, KR;

Nam-Soo Kim, Gyeonggi-do, KR;

Kyoung-Moon Kang, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/461 (2006.01); C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a slurry composition and a method of polishing a layer using the slurry composition, the slurry composition includes from about 3 to 20 percent by weight of an abrasive, from about 0.1 to 3 percent by weight of an ionic surfactant, from about 0.01 to 0.1 percent by weight of a nonionic surfactant, from about 0.01 to 1 percent by weight of a polish accelerating agent including an amino acid compound, and a remainder of an aqueous solution including a basic pH-controlling agent and water. The slurry composition including the nonionic surfactant and the polish accelerating agent may be used for speedily polishing a stepped upper portion of a silicon oxide layer, and may also enable a lower portion of the silicon oxide layer to function as a polish stop layer.


Find Patent Forward Citations

Loading…