The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Sep. 19, 2006
Masayuki Nakano, Chiyoda-ku, JP;
Yoshikazu Oshika, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Yoshikazu Oshika, Chiyoda-ku, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
A heat sink () is disclosed which comprises a substrate (), an electrode layer () formed on the substrate () and a solder layer () formed on the substrate () wherein the solder layer () provides a bonding strength of not less than 30 MPa and a shear strain of not less than 0.07. The heat sink may be a sub-mount which comprises a sub-mount substrate (), an electrode layer () formed on the substrate () and a solder layer () formed on the substrate () wherein the electrode layer () is formed with a window portion (A) having the solder layer () embedded therein and is connected to an outer peripheral area of the solder layer (). A sub-mount that has a high strength of bonding between the solder layer () and a semiconductor device is provided at a reduced cost.