The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
May. 21, 2010
Belgacem Haba, Saratoga, CA (US);
Kenneth Allen Honer, Santa Clara, CA (US);
David B. Tuckerman, Lafayette, CA (US);
Vage Oganesian, Palo Alto, CA (US);
Belgacem Haba, Saratoga, CA (US);
Kenneth Allen Honer, Santa Clara, CA (US);
David B. Tuckerman, Lafayette, CA (US);
Vage Oganesian, Palo Alto, CA (US);
Abstract
A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.