The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2012

Filed:

Aug. 22, 2006
Applicants:

Kazuyuki Ogawa, Osaka, JP;

Tetsuo Shimomura, Osaka, JP;

Yoshiyuki Nakai, Osaka, JP;

Masahiko Nakamori, Otsu, JP;

Takatoshi Yamada, Otsu, JP;

Inventors:

Kazuyuki Ogawa, Osaka, JP;

Tetsuo Shimomura, Osaka, JP;

Yoshiyuki Nakai, Osaka, JP;

Masahiko Nakamori, Otsu, JP;

Takatoshi Yamada, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); B32B 5/00 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.


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