The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Nov. 25, 2009
Applicants:
Kazumitsu Seki, Nagano, JP;
Muneaki Kure, Nagano, JP;
Akemi Nozaki, Nagano, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A lead frame includes a lead frame bodyhaving a die padto which a semiconductor chipis bonded and a plurality of leadsarranged around the die padand made of Cu or an alloy containing Cu, and a metallic film formed on the lead frame bodyand to connected to a metallic wireconnected to the electrode padof the semiconductor chip. The metallic film is an Ag-plated filmwith nanoparticlesarranged in gapsamong Ag crystal grains
Seki, Kazumitsu. (2012). Lead frame, method for manufacturing the same and semiconductor device (U.S. Patent No. 8304872). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8304872
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile