The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Dec. 28, 2009
Issaku Sato, Tokyo, JP;
Akira Takaguchi, Toyama, JP;
Issaku Sato, Tokyo, JP;
Akira Takaguchi, Toyama, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. By flowing the molten solderin the solder bathfrom inside of the inner cylinderto a nozzle cap, the inside of the nozzle capis filled with the molten solder, and the molten solderfilling the inside of the nozzle capis flown downward from between an inner cylinderand an outer cylinderwithout substantially flowing it to outside from an insert hole. This enables the molten solderto be prevented from oxidizing because the molten solderis not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzlewithout filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a leadof electronic componentbeing inserted into the insert hole, it is possible to fill the through hole of the printed circuit board P with the molten solder, so that the reliability can be improved.