The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Jul. 07, 2011
Tetsuo Tateishi, Nagoya Aichi, JP;
Matthew D Romig, Richardson, TX (US);
Tetsuo Tateishi, Nagoya Aichi, JP;
Matthew D Romig, Richardson, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A synchronous Buck converter in a molded package (thicknessbetween 0.8 and 1.0 mm) has vertically assembled control () and sync () power FET chips and a driver chip (). The sync chip has one power terminal attached to the leadframe pad () and the opposite power terminal covered by a first copper layer () connected () to a first leadframe terminal (), the first layer providing a smaller resistance to a current between first terminal and pad than the resistance through the sync chip. The control chip has one power terminal attached to the first layer and the opposite power terminal covered by a second copper layer () connected () to a second leadframe terminal (), the second layer providing a smaller resistance to a current from the first to the second terminal than the resistance through the control chip. Connections () of layers () to leadframe terminals () are copper wires of 20 to 50 μm diameter, enabling currents between 3 and 30 A.