The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2012

Filed:

Nov. 23, 2010
Applicants:

Ping-chuan Wang, Hopewell Junction, NY (US);

Chunyan E Tian, Hopewell Junction, NY (US);

Ronald Filippi, Hopewell Junction, NY (US);

Wai-kin LI, Beacon, NY (US);

Inventors:

Ping-Chuan Wang, Hopewell Junction, NY (US);

Chunyan E Tian, Hopewell Junction, NY (US);

Ronald Filippi, Hopewell Junction, NY (US);

Wai-kin Li, Beacon, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Structures of electronic fuses (e-fuse) are provided. An un-programmed e-fuse includes a via of a first conductive material having a bottom and sidewalls with a portion of the sidewalls being covered by a conductive liner and the bottom of the via being formed on top of a dielectric layer, and a first and a second conductive path of a second conductive material formed on top of the dielectric layer with the first and second conductive paths being conductively connected through, and only through, the via at the sidewalls. A programmed e-fuse includes a via; a first conductive path at a first side of the via and being separated from sidewalls of the via by a void; and a second conductive path at a second different side of the via and being in conductive contact with the via through sidewalls of the via.


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