The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Feb. 22, 2007
Seiji Karashima, Osaka, JP;
Yasushi Taniguchi, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Kenichi Hotehama, Osaka, JP;
Takashi Kitae, Osaka, JP;
Susumu Sawada, Osaka, JP;
Seiji Karashima, Osaka, JP;
Yasushi Taniguchi, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Kenichi Hotehama, Osaka, JP;
Takashi Kitae, Osaka, JP;
Susumu Sawada, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method for forming bumpson electrodesof a wiring boardincludes the steps of: (a) supplying a fluidcontaining conductive particlesand a gas bubble generating agent onto a first regionincluding the electrodeson the wiring board; (b) disposing a substratehaving a wall surfaceformed near the electrodesfor forming a meniscusof the fluid, so that the substratefaces the wiring board; and (c) heating the fluidto generate gas bubblesfrom the gas bubble generating agent contained in the fluid