The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Mar. 30, 2010
Tzu-yu Wang, Taipei, TW;
Chi-chun Hsieh, Tongluo Township, TW;
An-jhih Su, Bade, TW;
Hsien-wei Chen, Sinying, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Liwei Lin, Castro Valley, CA (US);
Tzu-Yu Wang, Taipei, TW;
Chi-Chun Hsieh, Tongluo Township, TW;
An-Jhih Su, Bade, TW;
Hsien-Wei Chen, Sinying, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Liwei Lin, Castro Valley, CA (US);
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An under-bump metallization (UBM) structure for a semiconductor device is provided. The UBM structure has a center portion and extensions extending out from the center portion. The extensions may have any suitable shape, including a quadrangle, a triangle, a circle, a fan, a fan with extensions, or a modified quadrangle having a curved surface. Adjacent UBM structures may have the respective extensions aligned or rotated relative to each other. Flux may be applied to a portion of the extensions to allow an overlying conductive bump to adhere to a part of the extensions.