The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Sep. 22, 2010
Kazuaki Mawatari, Beppu, JP;
Kengo Aoya, Beppu, JP;
Yoshikatsu Umeda, Beppu, JP;
Jeffrey A. West, Dallas, TX (US);
Kazuaki Mawatari, Beppu, JP;
Kengo Aoya, Beppu, JP;
Yoshikatsu Umeda, Beppu, JP;
Jeffrey A. West, Dallas, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An integrated circuit (IC) device includes a substrate having a top surface including substrate pads, and a through substrate via (TSV) die including a semiconductor substrate including a topside semiconductor surface having active circuitry and a bottomside surface. The topside semiconductor surface includes bonding connectors that are coupled to the substrate pads on the top surface of the substrate. A plurality of TSVs include an inner metal core that extends from the topside semiconductor surface to protruding TSV tips which extend out from the bottomside surface. At least one of the plurality of TSVs are dummy TSVs that have their protruding TSV tips exclusive of any electrically connection thereto that provide additional surface area that enhances heat dissipation from the bottomside of the TSV die.