The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2012

Filed:

Mar. 12, 2010
Applicant:

Yoshihiro Ihara, Nagano, JP;

Inventor:

Yoshihiro Ihara, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes: an electronic component including an electrode pad forming face on which electrode pads are formed, a back face opposite to the electrode pad forming face; a sealing resin including a first face provided on the electrode pad forming face side and a second face provided on the back face side, and provided around the electronic component to seal up a side face of the electrode component; a multilayer wiring structure which is provided on the first face, and in which insulating layers, a wiring pattern and external connecting pads are stacked on each other; and a conductive member which is provided in a through-hole passing through the sealing resin and the insulating layer. The wiring pattern is directly connected to the electrode pads and the external connecting pads, and includes a wiring provided in the insulating layers. The conductive member is connected to the wiring.


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