The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2012

Filed:

Jul. 27, 2010
Applicants:

Chang-ming Lee, Taoyuan County, TW;

Wen-fang Liu, Taoyuan County, TW;

Shih-jung Huang, Taoyuan County, TW;

Ling-kai Su, Taipei, TW;

Inventors:

Chang-Ming Lee, Taoyuan County, TW;

Wen-Fang Liu, Taoyuan County, TW;

Shih-Jung Huang, Taoyuan County, TW;

Ling-Kai Su, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 7/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a connector is provided. Firstly, a substrate having a first surface, a second surface opposite to the first surface and a through hole is provided. Next, a first conductive layer covering the inside wall of the through hole is formed on the substrate. Then, a filler is filled in the through hole to form a filler post. Next, a conductive elastic cantilever is formed over the first surface and electrically connected to the first conductive layer. Then, a gold layer is formed on the conductive elastic cantilever and over the first surface. A solder ball electrically connected to the first conductive layer is formed over the second surface.


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