The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Aug. 24, 2010
Thomas Schulze, Wilthen, DE;
Frank Kuechenmeister, Dresden, DE;
Michael Su, Round Rock, TX (US);
Lei Fu, Austin, TX (US);
Thomas Schulze, Wilthen, DE;
Frank Kuechenmeister, Dresden, DE;
Michael Su, Round Rock, TX (US);
Lei Fu, Austin, TX (US);
GLOBALFOUNDRIES, Inc., Grand Cayman, KY;
Abstract
A semiconductor device disclosed herein includes a conductive connection structure having a stepped profile that serves as a stress relief feature. The conductive connection structure includes a stress buffer arrangement for a contact pad. The stress buffer arrangement has a stepped via that terminates at the contact pad, and the stepped via has a plurality of inwardly sloped and concentric sections in a stacked orientation. The connection structure also includes underbump metallization overlying at least a portion of the contact pad and lining the stepped via, and a conductive connection element coupled to the underbump metallization. The conductive connection element fills the lined recess.