The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Aug. 06, 2010
Chih-peng Fan, Taoyuan County, TW;
Chih-Peng Fan, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A package substrate having embedded capacitor is provided. The package substrate includes a core circuit board, at least one dielectric layer, at least one embedded capacitor, and at least one metal layer. The core circuit board has at least one wiring layer, and the core circuit board has at least one conductive through hole connected to the wiring layer. At least one dielectric layer covers the wiring layer, and the dielectric layer has at least one conductive through hole. At least one embedded capacitor is embedded in the dielectric layer. At least one metal layer covers the dielectric layer and connected to the embedded capacitor, wherein the metal layer is connected to the wiring layer through the conductive through hole.