The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
May. 14, 2009
Chi Wah Cheng, New Territories, HK;
Lap Kei Chow, Kowloon, HK;
Chi Wah Cheng, New Territories, HK;
Lap Kei Chow, Kowloon, HK;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
A method for determining virtual cutting lines for a substrate prior to its singulation is provided whereby the substrate comprises first and second rows of alignment marks which are substantially parallel to each other such that a pair of alignment marks each from the first and second rows of alignment marks is configured for determining a position of a virtual cutting line. The method comprises the steps of positioning the first row of alignment marks along a relative motion path of a first camera and positioning the second row of alignment marks along a relative motion path of a second camera. While the substrate is being moved relative to the first and second cameras along the respective relative motion paths without stopping, the first and second cameras capture images of multiple pairs of alignment marks from the first and second rows of alignment marks during such motion. Thereafter, the position of each virtual cutting line is determined from the images of each pair of alignment marks along the first and second rows of alignment marks relating to the virtual cutting line and stored in a storage device for use during singulation.