The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2012

Filed:

Aug. 17, 2010
Applicants:

Michael Gaynes, Vestal, NY (US);

Michael S. Gordon, Yorktown Heights, NY (US);

Nancy C. Labianca, Carmel, CT (US);

Kenneth F. Latzko, Carmel, NY (US);

Aparna Prabhakar, North White Plains, NY (US);

Inventors:

Michael Gaynes, Vestal, NY (US);

Michael S. Gordon, Yorktown Heights, NY (US);

Nancy C. LaBianca, Carmel, CT (US);

Kenneth F. Latzko, Carmel, NY (US);

Aparna Prabhakar, North White Plains, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); G01R 31/00 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/58 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.


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