The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Jun. 06, 2008
Nobuo Naito, Tokyo, JP;
Hironori Kamiyama, Tokyo, JP;
Nozomi Kaga, Tokyo, JP;
Yuichi Miyazaki, Tokyo, JP;
Takeshi Nishizono, Tokyo, JP;
Hidetsugu Tazawa, Tokyo, JP;
Shinya Kiura, Tokyo, JP;
Nobuo Naito, Tokyo, JP;
Hironori Kamiyama, Tokyo, JP;
Nozomi Kaga, Tokyo, JP;
Yuichi Miyazaki, Tokyo, JP;
Takeshi Nishizono, Tokyo, JP;
Hidetsugu Tazawa, Tokyo, JP;
Shinya Kiura, Tokyo, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Abstract
Intended is to provide an electromagnetic shielding material having a conductive layer pattern by transferring a conductive composite to a transparent base material, and an electromagnetic shielding material having a metal layer formed on the transferred conductive layer. The electromagnetic shielding material is free from the troubles such as the breaking of wire, the non-conforming shape or the low contact, which is based on the non-conforming transfer of the conductive composite. The electromagnetic shielding material comprises a transparent base material, a primer layer formed over the transparent base material, and a conductive layer formed in a predetermined pattern on the primer layer. In the primer layer, a portion having the conductive layer formed therein has a thickness larger than the thickness of a portion without the conductive layer.