The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2012
Filed:
Jul. 13, 2009
Junichi Ito, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Yasuhiro Yamakoshi, Kitaibaraki, JP;
Shinichiro Senda, Kitaibaraki, JP;
Junichi Ito, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Yasuhiro Yamakoshi, Kitaibaraki, JP;
Shinichiro Senda, Kitaibaraki, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
A plated product made of a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion contains metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at a pH of 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at a pH of 10 or higher.