The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2012

Filed:

Nov. 11, 2008
Applicants:

Masatoshi Suzuki, Osaka, JP;

Youzou Yano, Osaka, JP;

Akio Suzuki, Osaka, JP;

Inventors:

Masatoshi Suzuki, Osaka, JP;

Youzou Yano, Osaka, JP;

Akio Suzuki, Osaka, JP;

Assignees:

Rohm Co., Ltd., Kyoto, JP;

Ulvac, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 46/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention improves a method of bonding by welding a plurality of filter units each having a frame body made of a resin member so as to provide a filter unit panel having excellent pressure resistance. This filter unit panel is obtained by disposing a plurality of filter units so that the outer peripheral surfaces of adjacent filter units () and () are partially in contact with each other but at least a part of the upper surfaces () and/or the lower surfaces () of the adjacent filter units are spaced apart from each other, and then melting a bonding resin so as to cause the melted bonding resin to flow into a gap () between the spaced upper surfaces and/or a gap () between the spaced lower surfaces and to cure. The bonding resin is supplied from, for example, protruding portions () and () of the frame body. This welding method increases the bonding strength between the filter units and increases the pressure resistance thereof accordingly.


Find Patent Forward Citations

Loading…