The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8278139 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 02, 2012

Filed:

Sep. 25, 2009
Applicants:

Siu F. Cheng, San Jose, CA (US);

Deenesh Padhi, Sunnyvale, CA (US);

Inventors:

Siu F. Cheng, San Jose, CA (US);

Deenesh Padhi, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus is provided for forming a resistive memory device having good adhesion among the components thereof. A first conductive layer is formed on a substrate, and the surface of the first conductive layer is treated to add adhesion promoting materials to the surface. The adhesion promoting materials may form a layer on the surface, or they may incorporate into the surface or merely passivate the surface of the first conductive layer. A variable resistance layer is formed on the treated surface, and a second conductive layer is formed on the variable resistance layer. Adhesion promoting materials may also be included at the interface between the variable resistance layer and the second conductive layer.


Find Patent Forward Citations

Cheng, Siu. (2012). Passivating glue layer to improve amorphous carbon to metal adhesion (U.S. Patent No. 8278139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8278139

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