The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
May. 26, 2006
Yuki Nishisaka, Osaka, JP;
Kenji Otoda, Osaka, JP;
Shuichi Inoue, Osaka, JP;
Toru Kumagai, Osaka, JP;
Yuki Nishisaka, Osaka, JP;
Kenji Otoda, Osaka, JP;
Shuichi Inoue, Osaka, JP;
Toru Kumagai, Osaka, JP;
Mitsuboshi Diamond Industrial Co., Ltd., Osaka, JP;
Abstract
A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile