The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Jul. 28, 2010
Applicants:

Shih-jung Huang, Taoyuan County, TW;

Wen-fang Liu, Taoyuan County, TW;

Ling-kai Su, Taipei, TW;

Inventors:

Shih-Jung Huang, Taoyuan County, TW;

Wen-Fang Liu, Taoyuan County, TW;

Ling-Kai Su, Taipei, TW;

Assignee:

Unimicron Technology Corp., Kwei-San Industrial Zone, Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.


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