The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Apr. 12, 2010
Hiroyuki Fujishima, Tokyo, JP;
Keiyo Kusanagi, Tokyo, JP;
Katsumi Sugawara, Tokyo, JP;
Koichi Hatakeyama, Tokyo, JP;
Hiroyuki Fujishima, Tokyo, JP;
Keiyo Kusanagi, Tokyo, JP;
Katsumi Sugawara, Tokyo, JP;
Koichi Hatakeyama, Tokyo, JP;
Elpida Memory, Inc., Tokyo, JP;
Abstract
A semiconductor device includes a substrate, a stack of semiconductor chips, and a first sealing material. The substrate may include, but is not limited to, a chip mounting area and a higher-level portion. The higher level portion surrounds the chip mounting area. The higher-level portion is higher in level than the chip mounting area. The stack of semiconductor chips is disposed over the chip mounting area. A first sealing material seals the stack of semiconductor chips. The first sealing material is confined by the higher-level portion.