The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2012

Filed:

Dec. 18, 2009
Applicants:

Lipyeow Yap, Santa Clara, CA (US);

Tuan Anh Nguyen, Sunnyvale, CA (US);

Dale R. Du Bois, Los Gatos, CA (US);

Sanjeev Baluja, Sunnyvale, CA (US);

Thomas Nowak, Cupertino, CA (US);

Juan Carlos Rocha-alvarez, San Carlos, CA (US);

Jianhua Zhou, San Jose, CA (US);

Inventors:

Lipyeow Yap, Santa Clara, CA (US);

Tuan Anh Nguyen, Sunnyvale, CA (US);

Dale R. Du Bois, Los Gatos, CA (US);

Sanjeev Baluja, Sunnyvale, CA (US);

Thomas Nowak, Cupertino, CA (US);

Juan Carlos Rocha-Alvarez, San Carlos, CA (US);

Jianhua Zhou, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the invention generally relate to a semiconductor processing chamber and, more specifically, a heated support pedestal for a semiconductor processing chamber. In one embodiment, a pedestal for a semiconductor processing chamber is provided. The pedestal comprises a substrate support comprising a conductive material and having a support surface for receiving a substrate, a resistive heater encapsulated within the substrate support, a hollow shaft coupled to the substrate support at a first end and a mating interface at an opposing end, the hollow shaft comprising a shaft body having a hollow core, and a cooling channel assembly encircling the hollow core and disposed within the shaft body for removing heat from the pedestal via an internal cooling path, wherein the substrate support has a heat control gap positioned between the heating element and the ring-shaped cooling channel.


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