The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Jan. 17, 2011
Taichi Nakamura, Osaka, JP;
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidetoshi Kitaura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Taichi Nakamura, Osaka, JP;
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidetoshi Kitaura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A manufacturing method for a bonded structure, in which a semiconductor device is bonded to an electrode by a bonding portion, the method including: first mounting a solder ball, in which a surface of a Bi ball is coated with Ni plating, on the electrode that is heated to a temperature equal to or more than a melting point of Bi; second pressing the solder ball against the heated electrode, cracking the Ni plating, spreading molten Bi on a surface of the heated electrode, and forming a bonding material containing Bi-based intermetallic compound of Bi and Ni; and third mounting the semiconductor device on the bonding material.