The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
Feb. 15, 2010
Takafumi Taguchi, Kanagawa, JP;
Toshiya Kotani, Tokyo, JP;
Michiya Takimoto, Kanagawa, JP;
Fumiharu Nakajima, Kanagawa, JP;
Ryota Aburada, Kanagawa, JP;
Hiromitsu Mashita, Kanagawa, JP;
Katsumi Iyanagi, Kanagawa, JP;
Chikaaki Kodama, Kanagawa, JP;
Takafumi Taguchi, Kanagawa, JP;
Toshiya Kotani, Tokyo, JP;
Michiya Takimoto, Kanagawa, JP;
Fumiharu Nakajima, Kanagawa, JP;
Ryota Aburada, Kanagawa, JP;
Hiromitsu Mashita, Kanagawa, JP;
Katsumi Iyanagi, Kanagawa, JP;
Chikaaki Kodama, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
Pattern formation simulations are performed based on design layout data subjected to OPC processing with a plurality of process parameters set in process conditions. A worst condition of the process conditions is calculated based on risk points extracted from simulation results. The design layout data or the OPC processing is changed such that when a pattern is formed under the worst condition based on the changed design layout data or the changed OPC processing a number of the risk points or a risk degree of the risk points of the pattern is smaller than the simulation result.