The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
May. 12, 2010
Chih-tsung Shih, Hsinchu, TW;
Chien-jen Sun, Hsinchu County, TW;
Jerry Chien, Chiayi County, TW;
Chu-liang Cheng, Taipei County, TW;
Yi-jen Chan, Taoyuan County, TW;
Chih-Tsung Shih, Hsinchu, TW;
Chien-Jen Sun, Hsinchu County, TW;
Jerry Chien, Chiayi County, TW;
Chu-Liang Cheng, Taipei County, TW;
Yi-Jen Chan, Taoyuan County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Elite Advanced Laser Corporation, Taipei Hsien, TW;
Abstract
A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.