The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2012

Filed:

Oct. 28, 2009
Applicants:

Jae-man Yoon, Hwaseong-si, KR;

Gyo-young Jin, Seoul, KR;

Hyeong-sun Hong, Seongnam-si, KR;

Makoto Yoshida, Suwon-si, KR;

Bong-soo Kim, Seongnam-si, KR;

Inventors:

Jae-man Yoon, Hwaseong-si, KR;

Gyo-young Jin, Seoul, KR;

Hyeong-sun Hong, Seongnam-si, KR;

Makoto Yoshida, Suwon-si, KR;

Bong-soo Kim, Seongnam-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 21/8246 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device and associated methods, the semiconductor device including a semiconductor layer including a first region and a second region, a first contact plug disposed on the semiconductor layer and electrically connected to the first region, a second contact plug disposed on the semiconductor layer and electrically connected to the second region, a conductive layer electrically connected to the first contact plug, the conductive layer having a side surface and a bottom surface, and an insulating layer disposed between the conductive layer and the second contact plug so as to insulate the conductive layer from the second contact plug, the insulating layer facing the side surface and a portion of the bottom surface of the conductive layer.


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