The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
Oct. 03, 2008
Applicants:
Shigeo Hashimoto, Tokyo, JP;
Teruyuki Hotta, Osaka, JP;
Takahiro Ishizaki, Osaka, JP;
Inventors:
Assignee:
C. Uyemura & Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); B32B 38/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (L) is formed on an insulating resin () that forms a first insulating layer (L). An insulating resin () that forms a second insulating layer (L) is laminated on the insulating resin () on which the circuit pattern has been formed. A trench () is formed in the laminated insulating resin () to expose the circuit pattern. An electroless plating metal () is buried by electroless plating in the trench () formed.