The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2012

Filed:

Nov. 08, 2005
Applicants:

Raymond Roger Shile, Los Gatos, CA (US);

Terrisa Duenas, Ventura, CA (US);

John Edward Bussan, Naperville, IL (US);

Gregory J. Athas, Lisle, IL (US);

Joseph S. Fragala, San Jose, CA (US);

Jason R. Haaheim, Chicago, IL (US);

Sylvain Cruchon-dupeyrat, Chicago, IL (US);

Jeffrey R. Rendlen, Glen Ellyn, IL (US);

Inventors:

Raymond Roger Shile, Los Gatos, CA (US);

Terrisa Duenas, Ventura, CA (US);

John Edward Bussan, Naperville, IL (US);

Gregory J. Athas, Lisle, IL (US);

Joseph S. Fragala, San Jose, CA (US);

Jason R. Haaheim, Chicago, IL (US);

Sylvain Cruchon-Dupeyrat, Chicago, IL (US);

Jeffrey R. Rendlen, Glen Ellyn, IL (US);

Assignee:

Nanolnk, Inc., Skokie, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Improved actuated probes suitable for scanning probe lithography or microscopy, and especially direct-write nanolithography and method of fabrication thereof. In one embodiment, thermomechanically actuated cantilevers with oxide-sharpened microcast tips are inexpensively fabricated by a process that comprises low-temperature wafer bonding, such as (gold) thermocompressive bonding, eutectic or adhesive bonding. Also provided is a flexcircuit that electrically interconnects the actuated probes to external circuitry and mechanically couples them to the instrument actuator. An improved scanning probe lithography instrument, hardware and software, can be built around the actuated cantilevers and the flexcircuit. Finally, provided is an improved microfluidic circuit to deliver chemical compounds to the tips of (actuated) probes and a fabrication method for tall, high-aspect-ratio tips.


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