The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8257546 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 04, 2012

Filed:

Sep. 29, 2003
Applicants:

Matthew Fenton Davis, Brookdale, CA (US);

John M. Yamartino, Palo Alto, CA (US);

Lei Lian, Santa Clara, CA (US);

Inventors:

Matthew Fenton Davis, Brookdale, CA (US);

John M. Yamartino, Palo Alto, CA (US);

Lei Lian, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus for monitoring an etch process. The etch process may be monitored using measurement information (e.g., critical dimensions (CD), layer thickness, and the like) provided ex-situ with respect to the etch process in combination with in-situ monitoring (e.g., spectroscopy, interferometry, scatterometry, reflectometry, and the like) performed during the etch process. The ex-situ measurement information in combination with the in-situ monitoring may be used to monitor for example, an endpoint of an etch process, an etch depth profile of a feature formed on a substrate, fault detection of an integrated circuit manufacturing process, and the like.


Find Patent Forward Citations

Davis, Matthew. (2012). Method and system for monitoring an etch process (U.S. Patent No. 8257546). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8257546

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