The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2012
Filed:
Aug. 16, 2007
Gang Ou, Singapore, CN;
Ajit Gaunekar, Singapore, CN;
Dongsheng Zhang, Singapore, CN;
Ka Shing Kenny Kwan, Singapore, CN;
Gang Ou, Singapore, CN;
Ajit Gaunekar, Singapore, CN;
Dongsheng Zhang, Singapore, CN;
Ka Shing Kenny Kwan, Singapore, CN;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A wire bonding apparatus, comprising a bonding tool mounted on a bondhead body which is in turn mounted on a positioning table, is provided for bonding electronic devices. The positioning table has first and second motors coupled to it that are operative to drive the bondhead body to positions along respective first and second orthogonal axes. The bondhead body is connected to the positioning table through a pivot such that the bondhead body is rotatable relative to the positioning table about a third axis which is substantially orthogonal to the first and second axes. Further, a third motor drives the bondhead body to rotate about the third axis.